Category:　　single-sided, double-sided, multi-layer
Laminate type:　FR-2, CEM-1, CEM-3, FR-4
Copper thickness:　0.5OZ-5OZ
Circuit formation:　dry film, photo imageable ink, silk-screen
Solder mask:　photo imageable ink, oven-cured ink, UV ink,　peelable, mask ink
Legend marking: oven-cured ink, Uvink
Conductive paste:　carbon paste, silver paste
Surface treatment: Hot air leveling, electro-nickel, electro-nickel/gold, electroless nickel/gold, Entek, preflux
Outline formation:　CNC routing, die punching, V-CUT, beveling
Circuit test:　computerized circuit test(10V-300V,insulation resistance 1-40MΩ)